Three provisional applications.
One priority date.

Subject matter

What the filings cover

Described here by category. The claim language itself is not published while the applications remain in their provisional year.

1. The vessel and the lattice

   A hollow rhombic-dodecahedral cavity whose interior facets are themselves the mounting planes, with modules seated upon them on a face-centred cubic lattice. All five of Fedorov's parallelohedra are claimed, together with the liner formed as the same solid one scale larger.

2. Self-pressurisation by dissipation

   A sealed rigid vessel charged with carbon dioxide above its critical density, in which the heat the processors dissipate raises the pressure and the pressure drives the circulation — with no pump, compressor or refrigeration plant within the boundary.

3. The liner as the interconnection substrate

   A faceted shell disposed within the pressure boundary which carries no pressure load, the working fluid standing upon both of its faces, so that an assembly which would conventionally be many boards joined by a network sits instead upon one continuous surface.

4. The unified memory face

   Graphics memory, main memory and non-volatile memory tiled upon a single module face in one pinwheel at a fixed proportion, in place of three separate assemblies each with its own substrate, connector and thermal path. The claims recite the proportion and the relation rather than any one part size.

5. Crossing the pressure boundary

   Electrical power and the full signal bandwidth of every module cross the pressure boundary by means disclosed and claimed in the third application — without a connector body, and without any penetration that derates the vessel. The mechanism is reduced to practice in the specification and is not described here while the applications remain in their provisional year.

6. An inorganic substrate

   A crystalline substrate serving at once as dielectric, heat conductor and expansion match to silicon, carrying the interconnection within the crystal rather than upon an organic laminate, and being inorganic cannot absorb the working fluid.

Distinction over the art

Where it departs from the closest reference

Sequence

Filing timeline

12 Aug 2026

First provisional application filed. Priority date established.

18 Aug 2026

Second provisional — electrical, thermal, mechanical and diagnostic architectures for computing hardware immersed in a supercritical working fluid.

8 Sep 2026

Third provisional — vessel and lattice geometry, the liner as interconnection substrate, the unified memory face, and the inorganic interconnection substrate.

12 Aug 2027

Non-provisional and international filings due.

Diligence

Reviewing the filings

The specifications are shared in confidence with investors and partners on request. Write and say which of the three you would like to read.